From the conceptual
to the drawing stage, manufacture and installation,
the professional staff at Johnsen
Ultravac has
the knowledge and expertise to create systems for
any application. Many years of experience have
enabled us to deliver practical and efficient solutions
for chamber configurations, loadlocks, sample transfers,
rotating stages, hoist/swing mechanisms, automation
and electrical, water or gas distribution.
Beginning
with high purity materials, the strictest quality
control standards and superior vacuum performance
to 10 -11 Torr range, every Johnsen
Ultravac system
package is a reliable investment. A few of the
systems we manufacture include:
Hybrid Plasma Spray System
The 6000 HPS system is comprised of a stainless
steel, double wall, water cooled, 30” x 36” process
chamber mounted on a stainless steel frame, plasma
torch, RF power generator and matching network,
substrate manipulator, pumps, gauging, process
control system, all integrated and tested as a
complete unit.
The RF/DC-ICP torch is mounted on
top of chamber. The plasma is generated from
a gas mixture is comprised
of 4 gasses which sprays around a cathode and
through an anode. An arc ignites the plasma.
Deposition
material can be introduced into the plasma jet
as powder or liquid. When liquid is
used nano structured coatings or deposits are
formed with a wide variety of material compositions.
Substrate
manipulation includes 6-axis of motion, high
speed substrate rotation and heating to
600° C.
A four gas distribution system
consists of mass flow controllers, 20 slm
range, MFC
power supply/LCD
display, inlet and purge valves and stainless
steel gas manifold.
The chamber is pumped
by a combination of a dry screw vacuum pump and
rotary booster
pump
complete
with water cooled foreline trap, air filter,
throttling valve. Vacuum measurement is
comprised of a capacitance
manometer and Pirani/Piezo Transducer.
A
PLC/PC based vacuum process automation system
controls the pump-down and plasma
deposition
process. The system is user friendly
with safety and process
interlocks as required.
Detailed specifications data available
on request. The system is modular in
design and can be
adapted to suit exact customer’s requirements.
E-Beam Evaporation Systems
Featuring single button operation
and utilizing a two-chamber design,
our evaporation
system maintains
the multi-pocket electron beam gun at UHV
within a cryopumped main chamber. Positioned
in the
load lock above the main chamber, the carousel
is separated
by an isolation gate valve. The automated
cycle pumps down the load lock and
opens the isolation
gate valve, thereby exposing the rotating
samples to the gun. Upon completion
of the evaporation
process, the load lock is vented while the
main chamber remains at UHV.
The unit also features:
- Automated pumping and venting
- Mimic panel displaying
system status
- Atmosphere to UHV in 30 minutes
- A motorized multi-sample
carousel
- Slide out bottom flange for easy maintenance
- ± 0.25% uniformity over 3 inch diameter samples
- Compact
self-enclosed frame
ECR/ICP System Configurations
The ECR/ICP System is designed to permit surface
processing by an ECR or ICP generated plasma
of up to three, 2"
diameter, or a single 5" wafer. Vacuum pressure
in the main chamber can reach pressures of less
than 1x10-10m.bar with turbo-molecular pumping.
Titanium sublimation pumping is optional.
The
system is installed on a support table with
a 19" electrical rack and power distribution
panel.
Laser Depositions
This system consists of a 10" O.D. cylindrical
vacuum chamber, main 510 1/sec. Turbomolecular
pump, pumping gate valve, two manipulators, target
holder and substrate holder. Viewports are integrated
into a single package, including gauges, table
and electrical distribution system. It is capable
of selecting one of six targets for laser deposition
onto a 2 – 3" diameter disc shaped substrate
holder with substrate heating. Sample substrates
can be loaded with a vacuum load-lock system.
The
mounted unit also includes blank-off flanges,
two viewports with shutters and a high purity optical
sapphire viewport. The vacuum is tested to 2x10-10
Torr with baking to 100° C.
Sputtering Systems
Our all-metal sputter system consists of three,
2" (or optionally 3") RF magnetrons
located at 120 degree intervals azimuthally spaced
around a 10" Conflat on the base of a cylindrical
chamber. This permits deposition onto a substrate
holder located on the chamber axis by any combination
of three shuttered sources. The system includes
chamber pumps, RF supplies, matching networks,
magnetrons, gas inlet, iris valve, vacuum gauging
and heated substrate holder. The unit also includes
a 19" enclosed electrical rack and table.
The vacuum chamber is an all-metal UHV chamber
(18" O.D. x 18" high) with wire seal
top and bottom flanges. It is equipped with hydraulic
lift mechanisms, sample stage port, pumping port
and various 2.75", 4.5" and 8" Conflat
ports, plus blanks. It also includes a removable
liner and shuttered 4" I.D. viewport.
In
the center of the bottom wire seal flange is
a 10" O.D. Conflat flange unit with three,
2" O.D. RF magnetrons, three electropneumatic
shutters, gas inlet port and a water cooled
cross contamination shield. The guns are capable
of
approximately 100 A/min Fe at 4 - 5" target
substrate spacing with a uniformity of ± 2%
over the target diameter.
MBE Vacuum Systems
The MBE Vacuum System consists of a 24" diameter
multiport chamber with internal LN2 shrouds for
molecular beam deposition of up to eight sources.
In addition, it features ports for viewports,
shutters, rate monitors, RGA, RHEED, samples
stage, pumping, gauging, and transfer as well
as future expansion ports. Mounted on a stainless
steel frame table, the vacuum system also features
electrical controls enclosed in two 19-inch electrical
racks, with power distribution panels and a master
on/off switch. Bake-out shrouds with internal
heaters for chamber heating to 250° C are provided. |
